| 翻訳と辞書 |
| Occam process ： ウィキペディア英語版 |
Occam process
The Occam process is a solder-free, Restriction of Hazardous Substances Directive (RoHS)-compliant method for use in the manufacturing of electronic circuit boards developed by Verdant Electronics. It combines the usual two steps of the construction of printed circuit boards (PCBs) followed by the population process of placing various leaded and non-leaded electronic components into one process.
==The Occam process==
Electronic components are first positioned onto an adhesive layer of a temporary or permanent substrate according to the customers needs and design parameters. Then, the pre-tested, burned-in components are held firm in their positions through encapsulating them in insulating material and the entire assembly is then inverted. The adhesive layer is then cut (after removing the temporary substrate if it exists) or drilled out over the component leads mechanically or by laser ablation. These holes are then plated with a conductive, copper connection (vias) from the top of this layer to the leads. If needed, other encapsulation layers of components or vias can be placed on top of each other to make multi-level circuit connections. This construction is then coated with copper where needed to provide traces. Thus, this finished circuit board can now receive a conformal coating to protect against the environment, and then be placed into an assembly housing or be sent to another section for mechanical and/or electrical connections with other PCBs.〔"Robust, Simplified and Solder-Free Assembly Processing of Electronics Products, Verdant Electronics White Paper, Sunnyvale, CA, 2007〕
抄文引用元・出典: フリー百科事典『 ウィキペディア（Wikipedia）』
■ウィキペディアで「Occam process」の詳細全文を読む
スポンサード リンク
| 翻訳と辞書 : 翻訳のためのインターネットリソース |
Copyright(C) kotoba.ne.jp 1997-2016. All Rights Reserved.
|
|